Electronics Assembly
Electronics Assembly Equipment
Surface Mount Technology (SMT)
- Juki 2060RL Pick & Place Machine (SMT component placement)
- Surface Mount Techniques Model 1414PD - solder paste screen printer
- Heller Model 1707EXL – 7 zone re-flow oven
- Fancort Model # VPD-3M1 – PCB array de-paneler
- Ungar SM100 – surface mount hot air re-work station
Through Hole (TH)
- Olamef axial lead cut / form system (bulk or tape)
- Elvo cut/bend – taped axial lead cut / form system
- Hepco Model 7900-LFA – DIP IC lead former
- Hepco Model 1500-1 (2) – radial lead prep
- Hepco Model 3000-2 – pre-form with multiple die sets
- Electrovert 14” wide wave solder with pneumatic flux control and pre-heat zone
- Q Corp mass lead trimmer – vacuum hold down
General Equipment
- Stoelting Trek (formerly Westek) Triton IV - de-ionized water (aqueous) board cleaning and drying system
- Eubanks 2600 series – wire prep machine (cut & strip or semi-strip)
- Advin MVP Pilot – IC programmer with 8-gang module
- Needham Electronics EMP-21 – IC / device programmer
- Scienscope binocular microscopes (SMT inspection)
- Pace and Hakko solder and solder / de-solder stations (multiple)
- Various test equipment: oscilloscopes, variable output DC power supplies, multi-meters, etc.
- Various crimp tooling (Molex, Amp, Amphenol, Thomas & Betts, etc.)